News

Feb 27, 2020

Ohio State and IIT-Bombay Present Research at Workshop in Mumbai

Indo-US Science and Technology Forum in Mumbai

Ohio State and the Indian Institute of Technology of Bombay (IIT Bombay) brought hundreds of scientists and engineers from the United States and India together for the Indo – U.S. Science and Technology Forum in Mumbai.

The “Frontiers of Excellence in Wide and Ultrawide Bandgap Semiconductors and Electronic Systems” forum facilitated a better understanding and exchange of information about state-of-the-art power devices and power electronic systems, as well as identified challenges and opportunities in the field. Ultimately, the workshop aimed to benefit research, development and deployment of power semiconductor devices and power electronics technologies in the immediate future in both countries.

Two faculty members from each university sat on the forum’s organizing committee: IIT Bombay professors Swaroop Ganguly and Saurabh Lodha, and Ohio State professors Siddharth Rajan and Steven Ringel, who is also the executive director of the Institute for Materials Research.

The Indo-U.S. Science and Technology Forum is just one aspect of growing partnerships between the two universities, coming on the heels of the recently established IIT Bombay - Ohio State Frontier Science and Engineering Research Center announcing its first round of awards to collaborative research teams from both institutions.

Under the Frontier Center Scholars Program, six collaborative research teams were awarded the Frontier Center Scholar Grants. Each team is comprised of a pair of principal investigators, one from IIT Bombay and another from Ohio State, as well as one doctoral student. Each doctoral student will spend at least four months at the partnering university as a Frontier Center Scholar.

The Frontier Center is a joint research center shared by IIT Bombay and Ohio State that launched in 2019 with the mission to create a global community of researchers, students and industry by leveraging both universities’ complementary strengths in materials, devices, components and systems.